• Source:JND
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Qualcomm has introduced the Snapdragon 8s Gen 3 chipset with AI-powered capabilities which will be powering the upcoming sub-flagship killer smartphones. Together with four cores, the new chipset 4nm has a Cortex-X4 prime core clocked at 3,0 GHz. UF 4.0 storage and up to 24GB of LPDDR5x RAM are also supported.

According to the business, support for generative AI features, an always-sensing ISP, incredibly lifelike mobile gaming, ground-breaking connection, and lossless high-definition sound are some of the important features.

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A wide range of AI models, including well-known large language models (LLM) like Baichuan-7B, Llama 2, and Gemini Nano, are supported by the platform. According to Chris Patrick, senior vice president and general manager of mobile handsets at Qualcomm Technologies, "With capabilities including on-device generative AI and advanced photography features, Snapdragon 8s Gen 3 is designed to enhance user experiences, fostering creativity and productivity in their daily lives."

The performance Snapdragon 8s Gen 3 is positioned between the Snapdragon 8 Gen 2 and the Snapdragon 8 Gen 3. It enables real-time hardware-accelerated ray tracing, but not global lighting. It also supports Wi-Fi 7 and Bluetooth 5.4, as well as displays with up to 4K resolution at 60fps or 2K resolution at up to 144Hz.

It also supports up to 200 MP cameras but does not have 8K video recording capabilities. There is fast UFS 4.0 compatibility for up to 24 GB LP-DDR5x RAM at up to 4200 MHz.

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It is expected that the first smartphone to use the Snapdragon 8s Gen 3 will be unveiled this month. "With the help of generative AI, we can now offer our customers a customised and high-end experience on the new mobile platform," stated William Lu, President of Xiaomi Corporation, President of the International Business Department, and General Manager of Xiaomi Brand.